Tèmik kondiktif silicone pad
* Kondiktivite tèmik: 1.5 ~ 15.0W / mK
* Aplikasyon konpresyon ki ba
* Fasil nan asanble ak ki kapab itilize ankò
* Siperyè tanperati andirans
* Ekselan izolasyon elektrik
* Doub kote yo nan tach natirèl nannan
* TV panèl plat, ekipman mobil, gwo vitès kondwi ki gen kapasite difisil
* Aparèy nan kay la, ekspozisyon LCD
* Pak batri pou nouvo enèji machin/otobis yo
* Odinatè, sèvè PC, estasyon travay
* Dirije ekleraj, ekipman ekleraj
* Ant semi-conducteurs ak chalè lavabo, processeurs pou chalè lavabo, GPU pou chalè lavabo
* Chip la ak eleman chip
* HDDVD chofè IC
* Konvèsyon pouvwa
* Motè otomobil / kontwòl misyon transmisyon
* GPU VRAM
* Kondwi depo mas
* LCD back-limyè modil
* Ekipman kominikasyon rezo
Pwopriyete | Inite | TS150 | TS200 | TS250 | TS300 | TS350 | TS400 |
Epesè | mm | 0.20 ~ 10.0 | 0.20 ~ 10.0 | 0.20 ~ 10.0 | 0.30 ~ 10.0 | 0.30 ~ 10.0 | 0.30 ~ 10.0 |
Koulè | - | Gri/Ble | Gri/Ble | Gri/Ble | Gri/Ble | Gri / Koulè wouj violèt | Gri / Koulè wouj violèt |
Dite | sc | 10 ~ 60 | 10 ~ 60 | 20 ~ 60 | 20 ~ 60 | 20 ~ 60 | 20 ~ 60 |
Kondiktivite tèmik | W/m·k | 1.5 | 2.2 | 2.5 | 3.1 | 3.6 | 4.1 |
Rezistans dife | UL-94 | V0 | V0 | V0 | V0 | V0 | V0 |
Fòs elektrik | Kv/mm | > 6.5 | > 6.5 | > 6.5 | > 6.5 | > 6.5 | > 6.5 |
Fòs rupture | MPa | 0.1 | 0.1 | 0.1 | 0.5 | 0.134 | 0.134 |
Chire fòs | N/MM | 1.5 | 1.5 | 1.5 | 0.4 | 0.279 | 0.279 |
Dansite | g/cm3 | 2.5 | 2.5 | 2.6 | 2.8 | 3.0 | 3.3 |
Adhesion andigman | Boul Steel | >10# | >10# | >10# | >10# | >10# | >10# |
Volim Rezistans | mΩ/m | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 |
Rezistans andigman | Ω | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 |
Tanperati travay | ℃ | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 |
Kontni siloxane | ppm | <500 | <500 | <500 | <500 | <500 | <500 |
Elongasyon | % | 50% | 50% | 50% | 50% | 50% | 50% |
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Pwopriyete | Inite | TS500 | TS600 | TS700 | TS800 | TS1000 | TS1300 |
Epesè | mm | 0.30 ~ 10.0 | 0.80 ~ 10.0 | 0.80 ~ 10.0 | 0.80 ~ 10.0 | 1.0 ~ 10.0 | 0.8 ~ 10.0 |
Koulè | - | Gri | Gri | Gri | Gri | Gri/Ble | Gri |
Dite | sc | 20 ~ 60 | 20 ~ 60 | 30 ~ 60 | 30 ~ 60 | 10 ~ 60 | 30 ~ 60 |
Kondiktivite tèmik | W/m·k | 5 | 6.1 | 7 | 8 | 10 | 13 |
Rezistans dife | UL-94 | V0 | V0 | V0 | V0 | V0 | V0 |
Fòs elektrik | Kv/mm | > 6.5 | > 6.5 | > 6.5 | > 6.5 | > 6.5 | > 6.5 |
Fòs rupture | MPa | 0.091 | 0.091 | 0.1 | 0.085 | 0.07 | 0.065 |
Chire fòs | N/MM | 0.49 | 0.45 | 0.8 | 0.35 | 0.3 | 0.28 |
Dansite | g/cm3 | 3.2 | 3.3 | 3.3 | 3.5 | 3.5 | 3.3 |
Adhesion andigman | Boul Steel | >10# | >10# | >10# | >10# | >10# | >7# |
Volim Rezistans | mΩ/m | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 | 1*10^13 |
Rezistans andigman | Ω | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 | 1*10^12 |
Tanperati travay | ℃ | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 | -40 ~ 200 |
Kontni siloxane | ppm | <500 | <500 | <500 | <500 | <500 | <5000 |
Elongasyon | % | 50% | 50% | 50% | 50% | 50% | 50% |
Kote orijin | Lachin |
Sètifikasyon | UL, REACH, ROHS, ISO 9001, ISO 16949 |
Sòti chak jou | 5 tòn |
Kantite Lòd Minimòm | 1000 pcs |
Pri (usd) | 0.05 |
Detay anbalaj | Nòmal ekspòtasyon anbalaj |
Kapasite Pwovizyon pou | 100000m² |
Pò livrezon | Shanghai |